Basic Info.
Shape
Sheet, Square, Round
Certification
TUV, ISO, CE
Specification
Circular: Diameter <= 14inch, Thickness >= 1mm.
Product Description
| Material Type | Silicon |
| Symbol | Si |
| Atomic Weight | 28.0855 |
| Atomic Number | 14 |
| Color/Appearance | Dark Gray with a Bluish Tinge, Semi-Metallic |
| Thermal Conductivity | 150 W/m.K |
| Melting Point (°C) | 1,410 |
| Bulk Resistivity | >1 OHM-CM, 0.005-0.020 OHM-CM, <0.1 OHM-CM |
| Coefficient of Thermal Expansion | 2.6 x 10-6/K |
| Theoretical Density (g/cc) | 2.32 |
| Dopant | Undoped, Boron, Phosphorous, Arsenic, or Antimony |
| Z Ratio | 0.712 |
| Sputter | RF |
Max Power Density*
(Watts/Square Inch) | 20 |
| Type of Bond | Indium, Elastomer |
| Comments | Alloys with W; use heavy W boat. SiO produced. |
General
Silicon is a solid at room temperature, with a melting point of 1,414 °C (2,577 °F) and a boiling point of 3,265 °C (5,909 °F). Like water, it has a greater density in a liquid state than in a solid state and it expands when it freezes, unlike most other substances. With a relatively high thermal conductivity of 149 W•m-1•K-1, silicon conducts heat well. Silicon sputtering target mainly used in in reactive magnetron sputtering to deposit dielectric layers such as SiO2 and SiN. As an important functional film material, they have good hardness, optical, dielectric properties and wear resistance. The corrosion resistance of Si targets have broad application prospects in optical and microelectronics fields, and are currently widely used as functional materials in the world. Currently, it mainly used for LCD transparent conductive glass, architectural LOW-E glass and microelectronics industry. The silicon sputtering targets can be divided into two types: single crystal and polycrystalline. We produce planar silicon sputtering targets through Czochralski crystal growth method.
Material Notes
Purity: 99.99%, 99.999%
Relative Density: ≥ 95%
Conductivity type: P-type & N-type
Circular: Diameter <= 14inch, Thickness >= 1mm
Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm
Targets Type: Planar sputtering target, Rotary sputtering target
Bonding is recommended for these materials. Many materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity.This material may require special ramp up and ramp down procedures. This process may not be necessary with other materials. Targets that have a low thermal conductivity are susceptible to thermal shock.
Other Information of Silicon Sputtering Targets
Applications
• Optical and decoration coating
• Semiconductor and thin film solar energy
• Flat panel displays | Features
• Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade |
Manufacturing Process
• Refining
Three-layer electrolytic process
• Melting and casting
Electrical resistance furnace - Semi-continuous casting
• Grain refinement
Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
Protection from environmental contaminants
Protection during shipment | Options
• 99.99% minimum purity
• Semiconductor grade silicon alloys available
Al/Si, Al/Cu/Si
• Smaller sizes also available for R&D applications
• Sputtering target bonding service | |
More about Silicon Sputtering Target products please visit the url:
https://www.made-in-china.com/showroom/aemuser
Address:
Rm. 408, Building 1, No. 31, Yinshan Road Yuelu District, Changsha, Hunan, China
Business Type:
Manufacturer/Factory
Business Range:
Chemicals, Manufacturing & Processing Machinery
Management System Certification:
ISO 9001, ISO 9000
Company Introduction:
Changsha Advanced Engineering Materials Limited (AEM) is an international company involved in the R & D, manufacturing and sales of all kinds of high-tech materials. We provide worldwide research institutes and high-tech enterprises with high purity non-ferrous materials, customized alloys, compounds and almost every kind of complicated synthetic material, etc. We have great advantages in magnetron sputtering targets, vacuum coating materials, high-purity metals, high-purity compounds, rare-earth metals, distilled rare-earth metals, coated substrates, etc.
